Hi-P Flex offers a wide range of Flexible Printed Circuitry which includes single sided reverse bared, double sided, and impedance controlled, HDI, multi-layer flex and rigid-flex with SMT assembly. With a core group of management and engineering team consisting of individuals with over 15 years of experience in the industry, Hi-P Flex can provide you with the support you need from application, design and DFM to delivering you quality product on time, every time.

● Application, Design, DFM support
● HDI, Multilayer Flex and Rigid Flex
● Micro Via, Blind and Buried Via
● In-House SMT & BGA assembly
● ICT testing
● VOC-Free no-clean process
● Lead Free Technology
● EL Dome Module
● Global sales and technical support