The demand for more innovative standards in process manufacturing plants is driving technology modifications which increasingly involve wireless applications. Hi-P brings the power of global efficiency and improved manufacturing performance to the growing wireless industry. We continue to successfully meet the challenge of streamlining costs under the most demanding conditions.

From project management to production ramp, we have extensive experience in dealing with the most complex customer needs. With established ESI offices around the world, we are able to provide valuable feedback on design and DFM on the outset of any new programs. Speed and flexibility are the keys to success in this rapidly changing industry and we at Hi-P Wireless understand these needs and are committed to deliver on-time results of the highest quality.Hi-P offers a proven track record of success for leading wireless companies in:

● Tablets
● Smart Phone
● Mobile Device Components
● Wearable Device

Manufacturing Capabilities

● Product Design
● Industrial & Mechanical Design
● Plastic & Surface Decoration
● Metal & Surface Decoration
● IMD/IML Sheet Window
● Module SMT
● Component Level Assembly
● Electro-Mechanics Assembly & Testing