GLOBAL R&D AND VERTICAL INTEGRATION DRIVING HARDWARE FOR AI, ROBOTICS, AND SMART MOBILITY.

ADVANCED MANUFACTURING
DEFINING PRECISION

R&D Excellence
The Foundation of Innovation

  • R&D Specialists
    600 +
  • R&D investment
    47M RMB
    2025
  • Patents
    441
    As of Dec 31, 2025
  • Green Patents
    131
    As of Dec 31, 2025

Digitized & Smart Management

Industry 4.0 & Precision Engineering: Empowering Next-Gen Vision.

  • Precision Tooling 4.0

    Precision Tooling 4.0

    Driving 3D smart mold manufacturing via deep PLM/MES integration; mastering multi-shot, insert, silicone, and breakthrough cube molding technologies.

  • Advanced Molding 4.0

    Advanced Molding 4.0

    Pioneering scientific molding with ultra-multi-cavity, Reel-to-Reel, and eco-friendly Green Molding for high-consistency, micro-precision components.

  • Smart Automation &
    AI Quality

    Smart Automation & AI Quality

    Developing customized automated equipment with integrated AI optical inspection for end-to-end quality monitoring and automated assembly.

Interconnecting the Future. Manufacturing for the AI Era.

Precision Tooling, Intelligent Connectivity — advancing Hi-P’s strategic vision for the AI era. With over four decades of manufacturing expertise, we are building next-generation integration of precision capabilities into AI/HPC infrastructure and future-ready connectivity.

  • PRECISION MANUFACTURING: THE FOUNDATION

    • Micron-level tooling accuracy (up to 0.002mm).

    • Industry 4.0 standard smart factories.

    • Global R&D hub for precision injection, metal stamping,
      and molding.

  • AI & HPC FRONTIERS: THE EXPLORATION

    • Venturing into AI-powered devices, intelligent robotics,
      and drones.

    • Exploring AI/HPC Infrastructure: high-density packaging, advanced cooling, and power management.

    • Pioneering high-speed, high-bandwidth data center connectivity.

  • FROM MANUFACTURING TO INTELLIGENCE

    • Rooted in Precision, Enabled by Connectivity,
      Accelerated by AI.

    • We aspire to redefine "precision" from micron-level dimensions to microsecond-level signal integrity.